Prediction of planarization property in copper film chemical mechanical polishing via response surface methodology and convolutional neural network

Laser Assisted Chemical Mechanical Polishing for Planarization

Surface Chemistry Studies of Copper Chemical Mechanical Planarization

Surface chemistry studies of the chemical mechanical planarization ~CMP! of copper are presented in this paper. Blanket copper samples were polished with an acidic alumina-based slurry which contains an organic acid salt ~phthalic acid salt! and an oxidizer (H2O2!. Surface studies using X-ray photoelectron spectroscopy ~XPS! were performed on copper samples after chemical etching or CMP in orde...

Wafer Scale Variation of Planarization Length in Chemical Mechanical Polishing

Chemical mechanical polishing (CMP) is widely used for pla-narization of advanced interconnect and shallow trench isolation structures in integrated circuit manufacture. Of particular concern is within-die variation in the interlevel dielectric or oxide thickness remaining after polish, due to pattern density variations across the die. 1 Recent modeling of CMP has shown that a " planarization l...

Direct Measurement of Planarization Length for Copper Chemical Mechanical Planarization Polishing (cmp) Processes Using a Large Pattern Test Mask

We have used a large pattern test mask and a specific arrangement of structures on a wafer for direct measurement of an average planarization length for copper chemical mechanical polishing (CMP) processes. We propose new minimum, maximum, and average planarization length definitions, based on up and down area measurements as a function of trench width. The average planarization length is usefu...

Chemical mechanical polishing of thin film diamond

The demonstration that Nanocrystalline Diamond (NCD) can retain the superior Young’s modulus (1100 GPa) of single crystal diamond twinned with its ability to be grown at low temperatures (<450 C) has driven a revival into the growth and applications of NCD thin films. However, owing to the competitive growth of crystals the resulting film has a roughness that evolves with film thickness, preven...